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W541C261 01726203 FN1198 74HC670N CL9P9L CXD2540Q XC3020 AAT1351
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  c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - a u g . , 2 0 1 1 a p l 3 2 1 3 / a w w w . a n p e c . c o m . t w 1 a n p e c r e s e r v e s t h e r i g h t t o m a k e c h a n g e s t o i m p r o v e r e l i a b i l i t y o r m a n u f a c t u r a b i l i t y w i t h o u t n o t i c e , a n d a d v i s e c u s t o m e r s t o o b t a i n t h e l a t e s t v e r s i o n o f r e l e v a n t i n f o r m a t i o n t o v e r i f y b e f o r e p l a c i n g o r d e r s . l i + c h a r g e r p r o t e c t i o n i c i n p u t o v e r - v o l t a g e p r o t e c t i o n o v e r - t e m p e r a t u r e p r o t e c t i o n h i g h i m m u n i t y o f f a l s e t r i g g e r i n g h i g h a c c u r a c y p r o t e c t i o n t h r e s h o l d s a v a i l a b l e i n t d f n 2 x 2 - 8 p a c k a g e lead free and green devices available (rohs compliant) c o m p l i a n c e t o i e c 6 1 0 0 0 - 4 - 2 ( l e v e l 4 ) + 8 k v ( c o n t a c t d i s c h a r g e ) + 1 5 k v ( a i r d i s c h a r g e ) t h e a p l 3 2 1 3 / a p r o v i d e l i + c h a r g e r p r o t e c t i o n a g a i n s t o v e r - v o l t a g e . t h e i c i s d e s i g n e d t o m o n i t o r i n p u t v o l t a g e . w h e n i n p u t v o l t a g e i s o v e r t h e t h r e s h o l d , t h e i c r e m o v e s t h e p o w e r f r o m t h e c h a r g i n g s y s t e m b y t u r n i n g o f f a n i n - t e r n a l s w i t c h . t h e p r o t e c t i o n a l s o h a v e d e g l i t c h t i m e a g a i n s t f a l s e t r i g g e r i n g d u e t o v o l t a g e s p i k e s . t h e a p l 3 2 1 3 / a a l s o p r o v i d e p o w e r - o n - r e s e t ( p o r ) f u n c t i o n a n d o v e r - t e m p e r a t u r e p r o t e c t i o n . t h e p o w e r - o n - r e s e t c i r c u i t m o n i t o r s s u p p l y v o l t a g e s t o p r e v e n t w r o n g o p e r a t i o n s . t h e o v e r - t e m p e r a t u r e p r o t e c t i o n l i m i t s t h e j u n c t i o n t e m p e r a t u r e b e l o w 1 4 0 o c i n c a s e o f s h o r t c i r c u i t o r o v e r l o a d c o n d i t i o n s . f e a t u r e s g e n e r a l d e s c r i p t i o n a p p l i c a t i o n s s m a r t p h o n e s a n d p d a s d i g i t a l s t i l l c a m e r a s p o r t a b l e d e v i c e s p i n c o n f i g u r a t i o n s i m p l i f i e d a p p l i c a t i o n c i r c u i t 8 out 7 out 5 nc 6 out acin 3 acin 1 acin 2 gnd 4 tdfn2x2-8 (top view) ep acin out gnd apl 3213 / a 5 v adapter or usb charger input
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - a u g . , 2 0 1 1 w w w . a n p e c . c o m . t w 2 a p l 3 2 1 3 / a a b s o l u t e m a x i m u m r a t i n g s ( n o t e 1 ) symbol parameter rating unit v acin acin input voltage (acin pin to gnd) - 0.3 to 20 v v out out, pin to gnd voltage - 0.3 to 7 v i out out output current 2 a t j maximum junction temperature 150 o c t stg storage temperature range - 65 to 150 o c t sdr maximum lead soldering temperature , 10 seconds 260 o c n o t e 1 : s t r e s s e s b e y o n d t h o s e l i s t e d u n d e r ? a b s o l u t e m a x i m u m r a t i n g s ? m a y c a u s e p e r m a n e n t d a m a g e t o t h e d e v i c e . t h e s e a r e s t r e s s r a t i n g s o n l y a n d f u n c t i o n a l o p e r a t i o n o f t h e d e v i c e a t t h e s e o r a n y o t h e r c o n d i t i o n s b e y o n d t h o s e i n d i c a t e d u n d e r ? r e c o m - m e n d e d o p e r a t i n g c o n d i t i o n s ? i s n o t i m p l i e d . e x p o s u r e t o a b s o l u t e m a x i m u m r a t i n g c o n d i t i o n s f o r e x t e n d e d p e r i o d s m a y a f f e c t d e v i c e r e l i a b i l i t y . t h e r m a l c h a r a c t e r i s t i c s symbol parameter typical value unit q ja junction to ambient t hermal r esistance in free air (note 2) tdfn2x2 - 8 75 c/w r e c o m m e n d e d o p e r a t i n g c o n d i t i o n s symbol parameter range unit APL3213 4.5 to 5.5 v v acin acin input voltage APL3213a 4.5 to 5.25 v i out out output current 0 to 1.5 a t j junction temperature - 40 to 125 c t a ambient temperature - 40 to 85 c note 2 : q ja is measured with the component mounted on a high effective thermal conductivity test board in free air. o r d e r i n g a n d m a r k i n g i n f o r m a t i o n n o t e : a n p e c l e a d - f r e e p r o d u c t s c o n t a i n m o l d i n g c o m p o u n d s / d i e a t t a c h m a t e r i a l s a n d 1 0 0 % m a t t e t i n p l a t e t e r m i n a t i o n f i n i s h ; w h i c h a r e f u l l y c o m p l i a n t w i t h r o h s . a n p e c l e a d - f r e e p r o d u c t s m e e t o r e x c e e d t h e l e a d - f r e e r e q u i r e m e n t s o f i p c / j e d e c j - s t d - 0 2 0 d f o r m s l c l a s s i f i c a t i o n a t l e a d - f r e e p e a k r e f l o w t e m p e r a t u r e . a n p e c d e f i n e s ? g r e e n ? t o m e a n l e a d - f r e e ( r o h s c o m p l i a n t ) a n d h a l o g e n f r e e ( b r o r c l d o e s n o t e x c e e d 9 0 0 p p m b y w e i g h t i n h o m o g e n e o u s m a t e r i a l a n d t o t a l o f b r a n d c l d o e s n o t e x c e e d 1 5 0 0 p p m b y w e i g h t ) . APL3213/a package code qb : tdfn2x2-8 operating ambient temperature range i : -40 to 85 o c handling code tr : tape & reel assembly material g : halogen and lead free device handling code temperature range package code APL3213 qb: x - date code assembly material 3213 x APL3213a qb: x - date code 213a x
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - a u g . , 2 0 1 1 w w w . a n p e c . c o m . t w 3 a p l 3 2 1 3 / a APL3213/a symbol parameter test conditions min. typ. max. unit power - on - reset (por) and supply current v por acin por threshold v acin rising 2.4 - 2.8 v acin por hysteresis - 250 - mv i cc acin supply current - 125 300 m a t b(acin) input power - on blanking time v acin rising to v out rising - 8 - ms internal power switch and out discharge resistance power switch on resistance i out = 0.6a - 130 - m w out discharge resistance v out = 3v - 500 - w input over - voltage protection (ovp) APL3213 5.70 5.85 6.00 v APL3213a, t a =25 o c 5.285 5.33 5.38 v v ovp input ov p threshold v acin rising APL3213a, t a = - 20~60 o c 5.28 5.33 5.4 v input ovp recovery hysteresis 150 250 350 mv input ovp propagation delay - 1 - m s t on(ovp) input ovp recovery time - 8 - ms over - temperature protection (otp) t otp over - temperature threshold - 140 - c over - temperature hysteresis - 20 - c refer to the typical application circuit. these specifications apply over v acin =5v, t a = -40~85 c , unless otherwise specified. typical values are at t a =25 c. e l e c t r i c a l c h a r a c t e r i s t i c s
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - a u g . , 2 0 1 1 w w w . a n p e c . c o m . t w 4 a p l 3 2 1 3 / a t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s a c i n s u p p l y c u r r e n t v s . j u n c t i o n t e m p e r a t u r e p o r t h r e s h o l d v s . j u n c t i o n t e m p e r a t u r e p o w e r s w i t c h o n r e s i s t a n c e v s . j u n c t i o n t e m p e r a t u r e i n p u t o v p t h r e s h o l d v s . j u n c t i o n t e m p e r a t u r e a c i n s u p p l y c u r r e n t , i a c i n ( m a ) 0 50 100 150 200 250 300 junction temperature ( xc ) - 50 - 25 0 25 50 75 100 125 p o r t h r e s h o l d , v p o r ( v ) 2 . 2 2 . 3 2 . 4 2 . 5 2 . 6 2 . 7 2 . 8 junction temperature ( ) o c - 50 - 25 0 25 50 75 100 125 v acin increasing v acin decreasing p o w e r s w i t c h o n r e s i s t a n c e , r d s , o n ( m 8 ) junction temperature ( o c ) - 50 - 25 0 25 50 75 100 125 0 50 100 150 200 250 acin to out on resistance o c junction temperature ( ) - 50 - 25 0 25 50 75 100 125 v acin increasing v acin decreasing apl 3213 a i n p u t t h r e s h o l d v o l t a g e ( m v ) 5 . 00 5 . 05 5 . 10 5 . 15 5 . 20 5 . 25 5 . 30 5 . 35 5 . 40
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - a u g . , 2 0 1 1 w w w . a n p e c . c o m . t w 5 a p l 3 2 1 3 / a o p e r a t i n g w a v e f o r m s refer to the typical application circuit. the test condition is v acin = 5v, c acin = 1 m f, c out =1 m f, t a = 25 o c unless otherwise specified. n o r m a l p o w e r o n ch 1 : v acin , 2 v / div , dc ch 3 : i out , 1 a / div , dc time : 2 m s / div r out = 3 w ch 2 : v out , 2 v / div , dc 1 2 3 v out i out v acin normal power off ch 1 : v acin , 2 v / div , dc ch 3 : i out , 1 a / div , dc time : 100 m s / div r out = 3 w ch 2 : v out , 2 v / div , dc 1 2 3 v out i out v acin ovp at power on ch 1 : v acin , 5 v / div , dc ch 3 : i out , 1 a / div , dc time : 2 m s / div v acin = 0 to 12 v ch 2 : v out , 2 v / div , dc 1 2 3 v out i out v acin ovp at power off 1 2 3 v out i out v acin ch 1 : v dd , 5 v / div , dc ch 3 : i out , 1 a / div , dc time : 40 m s / div v acin = 12 to 0 v ch 2 : v out , 2 v / div , dc
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - a u g . , 2 0 1 1 w w w . a n p e c . c o m . t w 6 a p l 3 2 1 3 / a o p e r a t i n g w a v e f o r m s refer to the typical application circuit. the test condition is v acin = 5v, c acin = 1 m f, c out =1 m f, t a = 25 o c unless otherwise specified. input over - voltage protection 1 2 3 v out i out v acin ch 1 : v acin , 5 v / div , dc ch 3 : i out , 1 a / div , dc time : 10 m s / div v acin = 5 to 12 v , r out = 3 w ch 2 : v chrin , 2 v / div , dc apl 3213 recovery from input ovp 1 2 3 v out i out v acin ch 1 : v acin , 5 v / div , dc ch 3 : i out , 1 a / div , dc time : 2 m s / div v acin = 12 to 5 v , r out = 3 w ch 2 : v chrin , 2 v / div , dc apl 3213
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - a u g . , 2 0 1 1 w w w . a n p e c . c o m . t w 7 a p l 3 2 1 3 / a pin no. name function 1, 2, 3 acin power supply input. 4 gnd ground . 5 nc no connection. 6, 7, 8 out output voltage pin. the output voltage follows the input voltage when no fault is detected. - ep exposed thermal pad. must be electrically connecte d to the gnd pin. p i n d e s c r i p t i o n b l o c k d i a g r a m gate driver and control logic acin out acin ovp gnd thermal shutdown por charge pump 0.5v
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - a u g . , 2 0 1 1 w w w . a n p e c . c o m . t w 8 a p l 3 2 1 3 / a t y p i c a l a p p l i c a t i o n c i r c u i t figure 1. the typical protection circuit for charger systems. acin out gnd apl 3213 / a charger 5 v adapter or usb 1 m f 1 m f li + battery 6 , 7 , 8 1 , 2 , 3 4
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - a u g . , 2 0 1 1 w w w . a n p e c . c o m . t w 9 a p l 3 2 1 3 / a over-temperature protection when the junction temperature exceeds 140 o c, the inter- nal thermal sense circuit turns off the power fet and allows the device to cool down. when the device?s junc- tion temperature cools by 20 o c , the internal thermal sense circuit will enable the device, resulting in a pulsed output during continuous thermal protection. thermal protec- tion is designed to protect the ic in the event of over- temperature conditions. for normal operation, the junc- tion temperature cannot exceed t j =+125 o c. f u n c t i o n d e s c r i p t i o n power-up the APL3213/a have a built-in power-on-reset circuit to keep the output shutting off until internal circuitry is oper- ating properly. the por circuit has hysteresis and a deglitch feature so that it will typically ignore undershoot transients on the input. when input voltage exceeds the por threshold and after 8ms blanking time, the output voltage starts a soft-start to reduce the inrush current. i n p u t o v e r - v o l t a g e p r o t e c t i o n ( o v p ) the input voltage is monitored by the internal ovp circuit. when the input voltage rises above the input ovp threshold, the internal fet will be turned off within 1 m s to protect connected system on out pin. when the input voltage returns below the input ovp threshold minus the hysteresis, the fet is turned on again after 8ms recovery time. the input ovp circuit has a 200mv hysteresis and a recovery time of t on(ovp) to provide noise immunity against transient conditions. figure 2. ovp timing chart v acin v out v ovp v por
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - a u g . , 2 0 1 1 w w w . a n p e c . c o m . t w 1 0 a p l 3 2 1 3 / a a p p l i c a t i o n i n f o r m a t i o n capacitor selection the input capacitor is for decoupling and prevents the input voltage from overshooting to dangerous levels. in the ac adapter hot plug-in applications or load current step-down transient, the input voltage has a transient spike due to the parasitic inductance of the input cable. a 25v, x5r, dielectric ceramic capacitor with a value be- tween 1 m f and 4.7 m f placed close to the acin pin is recommended. the output capacitor is for output voltage decoupling, and also the input capacitor of the charging circuit. at least, a 1 m f, 10v, x5r capacitor is recommended. in some failure modes, a high voltage may be applied to the device. make sure the clearance constraint of the pcb layout must satisfy the design rule for high voltage. the exposed pad of the tdfn2x2-8 performs the func- tion of channeling heat away. it is recommended that connect the exposed pad to a large copper ground plane on the backside of the circuit board through several ther- mal vias to improve heat dissipation. the input and output capacitors should be placed close to the ic. the high current traces like input trace and output trace must be wide and short. layout consideration
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - a u g . , 2 0 1 1 w w w . a n p e c . c o m . t w 1 1 a p l 3 2 1 3 / a p a c k a g e i n f o r m a t i o n t d f n 2 x 2 - 8 s y m b o l min. max. 0.80 0.00 0.18 0.30 1.00 1.60 0.05 0.60 a a1 b d d2 e e2 e l millimeters a3 0.20 ref tdfn2x2-8 0.30 0.45 1.00 0.008 ref min. max. inches 0.031 0.000 0.007 0.012 0.039 0.063 0.024 0.012 0.018 0.70 0.039 0.028 0.002 0.50 bsc 0.020 bsc 1.90 2.10 0.075 0.083 1.90 2.10 0.075 0.083 k 0.20 0.008 note : 1. followed from jedec mo-229 wccd-3. e l k e 2 pin 1 corner d2 a3 a1 b a e d
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - a u g . , 2 0 1 1 w w w . a n p e c . c o m . t w 1 2 a p l 3 2 1 3 / a package type unit quantity tdfn2x2 - 8 tape & reel 3000 c a r r i e r t a p e & r e e l d i m e n s i o n s application a h t1 c d d w e1 f 178.0 ? 2.00 50 min. 8.4+2.00 - 0.00 13.0+0.50 - 0.20 1.5 min. 20.2 min. 8.0 ? 0.20 1.75 ? 0.10 3.50 ? 0.05 p 0 p1 p 2 d 0 d1 t a 0 b 0 k 0 tdfn2x2 - 8 4.0 ? 0.10 4.0 ? 0.10 2.0 ? 0.05 1.5+0.10 - 0.00 1.5 min. 0.6+0.00 - 0 .4 3.35 min 3.35 min 1.30 ? 0.20 (mm) h t1 a d a e 1 a b w f t p0 od0 b a0 p2 k0 b 0 section b-b section a-a od1 p1 d e v i c e s p e r u n i t
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - a u g . , 2 0 1 1 w w w . a n p e c . c o m . t w 1 3 a p l 3 2 1 3 / a t a p i n g d i r e c t i o n i n f o r m a t i o n c l a s s i f i c a t i o n p r o f i l e t d f n 2 x 2 - 8 user direction of feed
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - a u g . , 2 0 1 1 w w w . a n p e c . c o m . t w 1 4 a p l 3 2 1 3 / a profile feature sn - pb eutectic assembly pb - free assembly preheat & soak temperature min (t smin ) temperature max (t smax ) time (t smin to t smax ) ( t s ) 100 c 150 c 60 - 120 seconds 150 c 200 c 60 - 1 2 0 seconds average ramp - up rate (t smax to t p ) 3 c/second ma x. 3 c/second max. liquidous temperature ( t l ) time at l iquidous (t l ) 183 c 60 - 150 seconds 217 c 60 - 150 seconds peak package body temperature (t p ) * see classification temp in table 1 see classification temp in table 2 time (t p ) ** within 5 c of the spe cified c lassification t emperature ( t c ) 2 0 ** seconds 3 0 ** seconds average r amp - down rate (t p to t smax ) 6 c/second max. 6 c/second max. time 25 c to p eak t emperature 6 minutes max. 8 minutes max. * tolerance for peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. ** tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. c l a s s i f i c a t i o n r e f l o w p r o f i l e s table 2. pb - free process ? classification temperatures (tc) package thickness volume mm 3 <350 volume mm 3 350 - 2000 volume mm 3 >2000 <1.6 mm 260 c 260 c 260 c 1.6 mm ? 2.5 mm 260 c 250 c 245 c 3 2.5 mm 250 c 245 c 245 c table 1. snpb eutectic process ? classification temperatures (tc) package thickness volume mm 3 <350 volume mm 3 3 350 <2.5 mm 235 c 22 0 c 3 2.5 mm 220 c 220 c r e l i a b i l i t y t e s t p r o g r a m test item method description solderability jesd - 22, b102 5 sec, 245 c holt jesd - 22, a108 1000 hrs, bias @ tj=125 c pct jesd - 22, a102 168 hrs, 100 % rh, 2atm , 121 c tct jesd - 22, a104 500 cycles, - 65 c~150 c hbm mil - std - 883 - 3015.7 vhbm ? 2kv mm jesd - 22, a1 15 vmm ? 200v latch - up jesd 78 10ms, 1 tr ? 100ma
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - a u g . , 2 0 1 1 w w w . a n p e c . c o m . t w 1 5 a p l 3 2 1 3 / a c u s t o m e r s e r v i c e a n p e c e l e c t r o n i c s c o r p . head office : no.6, dusing 1st road, sbip, hsin-chu, taiwan, r.o.c. tel : 886-3-5642000 fax : 886-3-5642050 t a i p e i b r a n c h : 2 f , n o . 1 1 , l a n e 2 1 8 , s e c 2 j h o n g s i n g r d . , s i n d i a n c i t y , t a i p e i c o u n t y 2 3 1 4 6 , t a i w a n t e l : 8 8 6 - 2 - 2 9 1 0 - 3 8 3 8 f a x : 8 8 6 - 2 - 2 9 1 7 - 3 8 3 8


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